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MCP1403/4/5
Placing a ground plane beneath the MCP1403/4/5 will
4.5.2
QUIESCENT POWER DISSIPATION
help as a radiated noise shield as well as providing
some heat sinking for power dissipated within the
device.
The power dissipation associated with the quiescent
current draw depends upon the state of the input pin.
The MCP1403/4/5 devices have a quiescent current
4.5
Power Dissipation
draw when both inputs are high of 1.0 mA (typ) and
0.15 mA (typ) when both inputs are low. The quiescent
The total internal power dissipation in a MOSFET driver
is the summation of three separate power dissipation
elements.
P T = P L + P Q + P CC
Where:
P T = Total power dissipation
P L = Load power dissipation
P Q = Quiescent power dissipation
power dissipation is:
P Q = ( I QH × D + I QL × ( 1 – D ) ) × V DD
Where:
I QH = Quiescent current in the high state
D = Duty cycle
I QL = Quiescent current in the low state
V DD = MOSFET driver supply voltage
P CC = Operating power dissipation
4.5.3
OPERATING POWER DISSIPATION
4.5.1 CAPACITIVE LOAD DISSIPATION
The power dissipation caused by a capacitive load is a
direct function of frequency, total capacitive load, and
supply voltage. The power lost in the MOSFET driver
for a complete charging and discharging cycle of a
MOSFET is:
The operating power dissipation occurs each time the
MOSFET driver output transitions because for a very
short period of time both MOSFETs in the output stage
are on simultaneously. This cross-conduction current
leads to a power dissipation describes as:
P CC = CC × f × V DD
P L = f × C T × V DD
Where:
f = Switching frequency
2
Where:
CC = Cross-conduction constant (A*sec)
f = Switching frequency
V DD = MOSFET driver supply voltage
C T = Total load capacitance
V DD = MOSFET driver supply voltage
? 2007 Microchip Technology Inc.
DS22022B-page 11
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